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Advanced Package Development Engineer

Apple

Apple

Marketing & Communications, Product
Santa Clara, CA, USA
Posted 6+ months ago

Key Qualifications

  • Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ-bumps, hybrid bonds, TSVs, etc.
  • Deep knowledge of electrical, mechanical and thermal properties of fab materials
  • Strong expertise in Si Fab equipment and Fab Logistics Management
  • Experience on advanced packaging for groundbreaking CMOS nodes
  • Expertise on Si structure yield and reliability mechanisms and analyses
  • Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis
  • Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT
  • Capable of independent R&D Work in a cross-functional team, driving vendors
  • Excellent communication skills
  • Experience in Si fab integration role and advanced packaging

Description

Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology development.

Education & Experience

BS and 10+ years of relevant industry experience.

Additional Requirements

Pay & Benefits